Asymtek SPECTRUM™ S-910 SERIES
Asymtek’s scalable Spectrum™ S-910 series with Fluidmove®XP (FmXP) software is ideal for highvolume
dispensing applications that do not require heat, such as surface mount adhesive (SMA), UV bonding, CMOS imaging, edge-bond and corner-bonding applications for mobile phones, PDAs and other handheld electronic devices. Incorporating over 25 years of automated fluid dispenser and jetting technology, the Spectrum series provides advanced process control and productivity features not previously available.

With its flexible, scalable configuration, the Spectrum S-910 series can be configured with single or dual lanes depending on your capacity and footprint requirements. As process needs change, the S-910 platform can be upgraded in the field to add options not previously required.
 
Advanced Process Control. Asymtek’s FmXP software offers advancements in throughput, fluid management, and process control. With multiple layers of operational control, FmXP allows operators to accomplish basic production tasks while providing engineers a user-friendly interface for program development. Using the CADImport utility, an FmXP program is quickly developed offline using existing CAD-generated data or a file from a placement machine. Available as an option, Asymtek’s patented Mass Flow Control (MFC) and optional Calibrated Process Jetting (CpJ™) modules ensure automatic fluid weight measurement and flow rate adjustment. The Spectrum’s digital vision system offers fast image acquisition for increased throughput.
Jet technology. Asymtek’s patented, non-contact, jetting offers many advantages over traditional needle dispensing. The DispenseJet® valve jets “on the fly” using a patented high-speed mechanism, shooting precise volumes of fluid in dots, lines and patterns with flow rates up to 500 mg/second and up to 200 dots/second. Jetting overcomes the limitations of needle dispensing – no bent needles, no chipped die, no dripping, no effects from warpage, and part interference is not an issue.
 
FEATURES:
• Scalable machine design matches current and future process requirements for maximum

     return on investment
• Pre- and post-stations without heat can be added for higher throughput or as buffer stations
• High-speed, Asymtek jetting of a wide variety of materials including surface mount

     adhesives (SMA), conductive adhesives, corner bond attach, CSP underfill and more
• Digital vision system provides high-speed fiducial image acquisition
• CADImport software for quick and efficient offline programming
• Slim design maximizes floor space utilization and lowers cost of ownership