A
aging(ageing) 时效
B
Brinel hardness 布氏硬度
Black band 黑带
Ball shear 焊料球剪切
BS ball shear strength 焊球剪切强度
BGA ball grid array 球形矩阵
Brittle fracture 脆性断裂
Bonding test 键合性能测试
C
CTE 热膨胀系数
CSP chip scale package 晶片尺寸构装
Cross section 剖面
Cold soldering 冷焊
Componet 元器件
Coarsening rate 粗化程度
Conductive adhesive 导电胶粘剂
Convection furnace 对流炉
Casting 热铸法
Cast microstructure 铸态组织
Creep resistance 蠕变性能
Coating substrate 基体涂层
Crack 裂纹
Cycle-dependent softening 循环软化
Cleavage fracture 解理断裂
Creep fracture 蠕变断裂
Coverage 铺展率
D
DSC the differential scanning catorimetry 差示扫描量热计
Die shear 冲模剪切
De-wetting 失润
Dip soldering 浸焊
Defect 缺陷
Die 裸片
Ductile fracture 延性断裂
E
Electrical conductivity 电导率
ECA electronically conductive adhesive 导电胶连接技术
Elongation 延伸率
Eutectic 共晶/共晶的
Electronic package and assembly 电子封装组装
ENIG electroless NI/Au 化镍金（化金）
electromigration 电迁移
Electronic solders 电子软钎料
EDX energy dispersive X-ray 能量散布X光分析技术
F
Flux 焊剂
Fracture 断裂
Fine pitch 微间距
Flip chip 倒装芯片
Film 薄膜
Film adhesive 粘结膜
Flaw 裂纹
FR4 flame-retardant substrate 玻璃纤维胶片
G
H
Hardness 硬度
HTS high temperature storage 高温存储实验
HASL hot air solder leveling 热风焊锡整平
I
Immersion Ag 化学沉银（化银）
Immersion Tin 化锡
IMC intermetallic compound 金属间化合物
Interface reaction 界面反应
Iron 电烙铁
Indexing 标定
Inter-granular fracture 晶间断裂
J
Joint 焊接接点
K
Kinetics 动力学
Kirkendall void 柯肯特尔效应
L
lead-free 无铅
Low-cycle fatigue 低周疲劳
M
MA mechanical alloying 机械合金化
Melting range 熔点区间
Microelectronics assembly technology 微电子组装
Microstructure 显微组织
Mechanism 机理
N
No-clean solder pas te 免清洗焊膏
NM no-metallic 非金属
Nano-indentation 纳米压痕技术
O
OSP organic solderability preservative 有机可焊性保护层
Open soldering 脱焊
One way ANOVA analysis 单因素方差分析
Over potential 超电势
OM optical microscope 光学显微镜
P
PCB printed circuit board 印刷电路板
Precipitate 析出沉淀
Precipitating strengthening 弥散强化
Process technology 工艺技术
Phase diagram 相图
Packaging density 装配密度
Q
Quasi-cleavage fracture 准解理断裂
R
RoHS Restriction of the use of certain Hazardous Substances in electrical and electronic equipment 关于在电子电气设备中禁止使用某些有害物质
RMA rosin middly activated (solder) 中性活性松香焊剂
RA rosin fully activated (solder) 活性松香焊剂
Reflow process 回流焊接工艺
RE rare earth 稀土元素
Reliability 可靠性
Rosin 松香
S
Solderability 钎焊性能
SAC Sn-Ag-Cu
SAC305 Sn-3.0Ag-0.5Cu
Solder bridge 桥焊
Solidifying 凝固
Solidus 固相线
Surface tension q ?面张力
Soldered points 焊点
Solder joint 焊接接点
Solder joint geometry 焊点形态
Solid solution strengthening 固溶强化
Shear strength 剪切强度
Spreading areas 铺展面积
SEM 扫描电镜
SMT surface mount technology
Substrate 基体
Solder paste 焊膏
T
Thermal conductivity 热导率
two way ANOVA analysis 双因素方差分析
Trans-granular fracture 穿晶断裂
Three-dimensional 三维
Ternary phase diagram 三元相图
Trace elements 微量元素
Thermodynamic calculation 热力学计算
Tensile strength 抗拉强度
The liquidus temperature and the solidus temperature 液固相线温度
Thermal cycle reliability 热循环可靠性
Tension 表面张力
U
UBM 焊球下金属化层
Underfill dispensing 点胶式底部填充
V
Void 空洞
W
WEEE Waste electrical and electronic equipment 报废电子电气设备
Wave soldering 波峰焊接技术
wettability 润湿性能
wetting angle 浸润角