理想状况Target Condition
1.引_的让,_跟吃a良好
2.引_c板子焊|g呈F凹面
  焊aА
3.引_的廓清楚可。
1.side face and footprint have good solder fillet
2.concave fillet between land and lead
3.the shape(profile)of lead be clearly visible

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允收状况5  Accept Condition
1.引_的底c板子焊|g的Iaе辽俸w引_L的2/3L以上。
2._跟(Heel)焊aШw高度h大於零件_1/2厚度。
  (hR1/2T) 。
3._跟(Heel)沾a角需<90度。
1.Width of solder fillet between lead and land(X) shall over 2/3 lead footprint(L)
2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel
3.Wetting angle ＜90∘on heel
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拒收状况5 Reject Condition
1.引_的底c板子焊|g的IaР蛔愫w引_L的2/3L。
2._跟(Heel)焊aШw高度 h小於零件_1/2厚度(h<1/2T) 。
3._跟(Heel)沾a角R90度。(MI)
4.Whichever is rejected