理想状况Target Condition
1.凹面焊aТ嬖陟兑的四
2.焊aа由斓揭曲鹊捻部(A,B)。
3.引的廓清楚可。
4.所有的ac表面皆吃a良好。
1.Solder concave fillet on the 4 face of lead
2.solder flow up to the angle high point A,B
3.Lead shape(profile)can be clearly visible
4.Good soldering joint at every solder contact
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允收状况7  Accept Condition
1.焊aТ嬖陟兑的三
2.焊aШw引曲鹊50%以上(hR1/2T)。
1.Solder concave fillet on the 3 face of lead
2.Height of solder flow-up on the lead angle(h) shall over 1/2 angle height(T)
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拒收状况7 Reject Condition
1.焊aТ嬖陟兑的三纫韵(MI)。
2.焊aШw引曲鹊50%以下(h<1/2T)(MI)。
3.Whichever is rejected .
1.Solder concave fillet is less 3 face
2.Height of solder flow-up on the lead angle(h) under 1/2 angle height(T)
3.Whichever is rejected