理想状况Target Condition
1.凹面焊aТ嬖陟兑的四
2.焊aа由斓揭曲鹊捻部(A,B)。
3.引的廓清楚可。
4.所有的ac表面皆吃a良好。
1.Solder concave fillet on the 4 face of lead
2.solder flow up to the angle high point A,B
3.Lead shape(profile)can be clearly visible
4.Good soldering joint at every solder contact
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允收状况9  Accept Condition
1.凹面焊aа由斓揭
  曲的上方,但在M件本
　w的下方。
2.引部的廓清楚可。
1.Solder flow up to top of lead angle and not touch the body
2.Shape(profile)of lead angle can be visible clearly
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拒收状况9Reject Condition
1.焊aЫ佑|到M件本w(MI)。
2.引部的廓不清楚(MI)。
3.a突出焊|(MI)。
4.Whichever is rejected .
1.Solder had touched the body
2.Shape (profile) of lead angle can not be visible clearly
3.Excess solder on the side of solder land