理想状况Target Condition
1.焊a是凹面K且木片端O底部延伸到部的2/3T以上。
2.a皆良好地附著於所有可
  焊接面。
1.Solder flow up from land (bottom of component solder termination to the 2/3 Height of component (T)
2.Good solder fillet on the all solder able terminations (face)
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允收状况10 Accept Condition
1.焊aа由斓骄片端O高度的25%以上。
　(hR1/4T)
2.焊a木片外端向外延伸到焊|的距x榫片高度的25%以上。(XR1/4H)
1.1/4 component height be fillet by solder at least
2.Solder flow spread on the land shall 1/4 width of component height at least , (Count from tip of component)
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拒收状况10Reject Condition
1.焊aа由斓骄片端O高度的25%以下(MI)。
　(h＜1/4T)
2.焊a木片外端向外延伸到焊|端的距x榫片高度的25%以下(MI)。
　(X＜1/4T)
3.Whichever is rejected .