理想状况Target Condition
1.o任何a珠、a渣留於
　PCB。
1.No solder ball and solder dross leave on PCB

$Page_Split$

允收状况13  Accept Condition
1.a珠、a渣不可被除者或不易被除者,直D或L度LQ10mil。(D,LQ10mil)
1.The diameter of solder ball / solder dross which can remove or not shall small than 10 mil
$Page_Split$

拒收状况13 Reject Condition
1.a珠、a渣不可被除者  或不易被除者,直D或L度L>10mil。(D,L>10mil)(MI)且<10mil每平方英寸不得超^5w
2.Whichever is rejected.