理想状况Target Condition
1.为跳平N於C板表面。
2.固定用跳不得浮高,跳需平N零件。
1.Jumper wire lay flat and touch the board
2.Jumper wire used for fixing component shall touch the component body
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允收状况18 Accept Condition
1.为跳Lh,WhQ1.0mm。
2.被固定零件浮高Q1.0mm
。(YQ1.0mm)
3.固定用跳投影於PCB後左右偏移量Q零件孔1.0mm。(XQ1.0mm)
4.固定用跳浮高ZQ0.8mm(被固定零件平N於PCBr)
1.The height of jumper wire above the land is 1.0mm Maximum
2.Jumper wire used for fixing component is 0.8mm maximum
3.The shift length of reflection of jumper wire used for fixing component on the board is 1.0mm maximum measuring from the edge of PTH
4.The height of jumper wire above the component is 0.8mm maximum since component lay flat
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拒收状况18 Reject Condition
1.为跳Lh,Wh>1.0mm(MI)。
2.被固定零件浮高>1.0mm(MI)
。(Y>1.0mm)
3.固定用跳投影於PCB後左右偏移量>零件孔1.0mm
(MI)。(X>1.0mm)
4.固定用跳浮高Z>0.8mm
(被固定零件平N於PCBr)(MI)
5. Whichever is rejected
smt焊接允收标准18
日期:2009-12-10 10:16 点击:434