理想状况Target Condition
1.浮高cA斜之判定量y以PCB零件面c零件基座之最低c榱y依。
2.C零件基座平NPCB零件面,o浮高A斜。(a,b,c,d四c平N於PCB)。
1.The floating height is measure from face of PCB substrate to the lowest point of component
2.The base of constructive component shall touch the face of PCB substrate (a,b,c,d point touch PCB)
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允收状况19 Accept Condition
1.短Sa,b牲c平NPCB或垂直上浮,但c,d牲c浮高Q0.8mm。(Lh Q0.8mm)
2.a面可零件_出孔
3.o短路。
1.The height of component short axis side above the land is 0.8mm maximum
2.Lead protrusion can be identified on solder side
3.No solder bridge
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拒收状况19 Reject Condition
1.短Sa,b牲c平NPCB或垂直上浮,但c,d牲c浮高>0.8mm(MI)。(Lh >0.8mm)
2.零件_折_、未入孔、缺件等缺c影功能(MA)。
3.短路(MA)。
4.Whichever is rejected .
smt焊接允收标准19(载全)
日期:2009-12-10 10:16 点击:407