行业分类
印锡模板开口设计
日期:2009-11-19 21:59  点击:297
■ 宽厚比=开口的宽度(W)/模板的厚度(T)>1.5
■ 面积比=开口面积(LXW)/孔壁的面积[2*(L+W)*T]>0.66
■ 一般印焊膏模板开口尺寸及厚度
元件类型
PITCH
焊盘宽度
焊盘长度
开口宽度
开口长度
模板厚度
宽度比
面积比
PLCC
1.27mm
0.65mm
2.0mm
0.60mm
1.95mm
0.15-0.25mm
2.3-3.8
0.88-1.48
(50mil)
(25.6mil)
(78.7mil)
(23.6mil)
(76.8mil)
(5.91-9.84mil)
QFP
0.635mm
0.635mm
0.635mm
0.635mm
0.635mm
0.635mm
1.7-2.0
0.71-2.0
(25mil)
(13.8mil)
(59.1mil)
(11.8mil)
(57.1mil)
(5.91-7.5mil)
QFP
0.50mm
0.254-0.33mm
1.25mm
0.22-0.25mm
1.2mm
0.125-0.15mm
1.7-2.0
0.69-0.83
(20mil)
(10-13mil)
(49.2mil)
(9-10mil)
(47.2mil)
(4.92-5.91mil)
QFP
0.40mm
0.25mm
1.25mm
0.2mm
1.2mm
0.10-0.125mm
1.6-2.0
0.68-0.86
(15.7mil)
(9.84mil)
(49.2mil)
(7.87mil)
(47.2mil)
(3.94-4.92mil)
QFP
0.30mm
0.20mm
1.00mm
0.15mm
0.95mm
0.075-0.125mm
1.50-2.0
0.65-0.86
(11.8mil)
(7.87mil)
(39.4mil)
(5.91mil)
(37.4mil)
(2.95-3.94mil)
0402
 
0.50mm
0.65mm
0.45mm
0.6mm
0.125-0.15mm
 
0.84-1.00
 
(19.7mil)
(25.6mil)
(17.7mil)
(23.6mil)
(4.92-5.91mil)
0201
 
0.25mm
0.40mm
0.23mm
0.35mm
0.075-0.125mm
 
0.66-0.89
 
(9.84mil)
(15.7mil)
(9.06mil)
(13.8mil)
(2.95-3.94mil)
BGA
1.27mm
φ0.80mm
 
φ0.75mm
 
0.15-0.20mm
 
0.93-1.25
(50mil)
(31.5mil)
 
(29.5mil)
 
(5.91-7.87mil)
U BGA
1.00mm
φ0.38mm
 
φ0.35mm
0.35mm
0.115-0.135mm
 
0.67-0.78
(39.4mil)
(15.0mm)
 
(13.8mil)
(13.8mil)
(4.53-5.31mil)
U BGA
0.50mm
φ0.30mm
 
φ0.28mm
0.28mm
0.075-0.125mm
 
0.69-0.92
(19.7mil)
(11.8mm)
 
(11.0mil)
(11.0mil)
(2.95-3.94mil)
Flip Chip
0.25mm
0.12mm
0.12mm
0.12mm
0.12mm
0.08-0.10mm
 
1.0
(10mil)
(5mil)
(5mil)
(5mil)
(5mil)
(3-4mil)
Flip Chip
0.20mm
0.10mm
0.10mm
0.10mm
0.10mm
0.05-0.10mm
 
1.0
(8mil)
(4mil)
(4mil)
(4mil)
(4mil)
(2-4mil)
Flip
Chip
0.15mm
0.08mm
0.08mm
0.08mm
0.08mm
0.025-0.08mm
 
1.0
(6mil)
(3mil)
(3mil)
(3mil)
(3mil
 
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