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led贴片机msr
| 产品名称：松下贴片机MSR |
| 贴片速度： 0.08sec/片 |
| 重量：2000kg |
| PCB尺寸： 最小 50mm×50mm最大330mm×250mm |
| 贴片站位：120+80站位 |
| 贴片精度：正负0.025mm |
| 电压：200V |
| 适用元件：0201-55MM/0.4QFP,0.3B/0.5P BGA |
| 富士二手贴片机系列： | ||
| Model | No/ Features | Made |
| CP3 | 0.25sec,140cst(70+70),12 head*2 nozzle | 88-93 |
| CP4 | 0.18sec,140cst(70+70),12 head*3 nozzle,1005-20mm QFP/PLCC | 91-93 |
| CP42 | 0.18sec,140cst(70+70),12 head*3 nozzle,(3 type),457*356mm | 93-94 |
| CP43 | 0.15sec,160cst(70+70),12 head*3 nozzle,1005-20mm SQFP/PLCC | 93-94 |
| CP6 | 0.09sec,140cst(70+70),6 nozzle,457*356mm(MAX),Twin D-Axis Motor | 94- |
| CP642 | 0.09sec,140cst(70+70),6 nozzle贴片范围:0402,0603~32mmQFPs,SOPs,(A~D), | |
| CP643 | 0.09sec,140cst,PCB Loard,0.7sec,6 nozzle,356*457mm | |
| XP143E | 贴装速度：0.165秒/个，21800个/小时：矩形元件；0.180/秒/个，20000个/小时：0402贴装精度:±0.050mm cpk≧1.00 : 矩形元件等； ±0.040mm cpk≧1.00 : QFP等0402-25mm*20mm 最大高度：6mm | |
| XP242E | 贴片速度：0.43s/chipIC，0.56s/QFP IC贴片精度：±0.025mm 对象元件：贴片范围：1005-45x150mm，高度25.4mm以下的零件 | |
| QP242 | 贴片精度 Chip:±0.1mm QFP:±0.04mm Flip Chip:±0.03mm搭载料架 600-series:21 800-series:31 Tray:50+50元件范围 1.0x0.5mm-口74x74mm | |
| 松下二手贴片机系列 | ||
| Model | No/ Features | Made |
| MVⅡ | 0.18sec,56+55cst,12 head(5 nozzle),M size | 90-92 |
| MVⅡC | 0.14sec,75+75cst,12 head(5 nozzle),M size | 93-95 |
| MSHⅡ | 0.094sec,61+60cst 16 head(3 nozzle),M size | 94-97 |
| MVⅡF | 0.16sec,(72500oph),30+30 | 96 |
| MVⅡVB | 0.1sec,75+75cst,12 head(5 nozzle),PC Board dimension 50*50 to 510*460mm | |
| MSR | 0.08sec,75+75cst 16 head(6 nozzle),PC board dimension:50*50 to 510*460mm | |
| MPAV2B | 0.8sec/chip 1.0sec/QFP,BGA,3 nozzle | |
| MPAG3 | 0.8sec/chip 1.0sec/QFP,BGA,3 nozzle | |
| HDPG1 | 0.12sec,3 nozzle | 94-96 |
| HDF | 0.07sec,3 type nozzle screw type head,PC board dimension:50*50 to 330*250mm | |
| SPPG3 | 13sec,PC board dimension:50*50 to 330*250mm | |
| CM86C-M2 | 0.1sec,140cst(35+35+35+35),12 head(6 nozzle),330*250mm | |
| CM88C-M | 0.085sec/chip 0.12sec/sop IC,70+70cst,12 head(5 nozzle),330*50m | |
