KE2020 1、理论贴片速度:CPH11000,IC 1800CPH 2、料站位:80 3、最大PCB尺寸:KE2020M,330mm/250mm;KE2020L,410mm/360mm;KE2010E,520mm/460mm 4、贴片精度:CHIP :±0.08mm;IC :±0.04mm 5、元件范围:8mm-72mm带状,散装料,带托盘