三星贴片机SM411F

SM411F
Placement Speed
  - Chip 30K CPH (IPC9850)
    SOP 23K CPH (IPC9850)
    QFP 5.5K CPH (IPC9850)
Applicable Parts
  - Max. 0402 ~ ∴14mm
    (Part Height H=12mm)
Placement Accuracy
  - Chip 【50 (Cpk 1.0)Л
    QFP 【30Л (Cpk 1.0)
Applicable PCBs
  - L510 x W300 x 1Lane (Standard)
    Max. L750 x W420 x 1Lane
SM411F
贴装速度
 - Chip 30K CPH (IPC9850) /
    SOP 23K CPH (IPC9850) /
    QFP 5.5K CPH (IPC9850)
对应元器件
 - Max. 0402 ~ □14mm
    (元器件高度 H=12mm)
贴装精度
 - Chip ±50 (Cpk 1.0)? /
    QFP ±30? (Cpk 1.0)
PCB尺寸
  - L510 x W300 x 1Lane (标准) /
    Max. L750 x W420 x 1Lane
High Speed Flexible Mounter

SM411F is a high speed component placer for placing odd shaped parts, which is equipped with the platform (dual gantry) of SM411, which is a chip shooter, and the vision system of SM421. It can maximize the production speed of odd shaped parts by up to 150% ~ 200% compared to that of SM421.

In addition, the accessories including side tray and automatic flux dipping unit were improved and the operational convenience was enhanced by installing front/rear auxiliary tower lamps. It is also applicable to POP.
High Speed Flexible Mounter

SM411F以射片机SM411的平臺(雙式起重臺架)爲基礎, 侮異型机SM421視袈係統相結合的高速異型貼片机, 侮SM421相比將異型生産速度提高爲最大150% ~ 200%, 可達到異型生産性的極大化。

而且, 以增强附婁品(自動滴僅單位/側托盤), 可麟現POP的麟裝捲應和强化送料机的運用便利性。

SM411
Placement Speed
  - Chip 42K CPH (IPC9850)
Applicable Parts
  - Max. 0402 ~ ∴14mm
    (Part height H=12mm)
Placement Accuracy
  - Chip/IC 【50Л (Cpk 1.0)
Applicable PCBs
  - L460 x W250 x 2Lane
    (Standard)
  - L510 x W460 x 1Lane
    (Standard)
  - Max. L610 x W460 x 1Lane
SM411
贴装速度
  - Chip 42K CPH (IPC9850)
对应元器件
  - Max. 0402 ~ □14mm
    (元器件高度 H=12mm)
贴装精度
  - Chip/IC ±50? (Cpk 1.0)
PCB尺寸
  - L460 x W250 x 2Lane(标准)
  - L510 x W460 x 1Lane(标准)
  - Max. L610 x W460 x 1Lane
Dynamic Chip Shooter

The SM411 has achieved the highest placement speed of 42,000 CPH for chips and 30,000 CPH for SOP parts (based on IPC, respectively) in the world among machines of the same class by adopting a dual gantry mechanism
and On-The-Fly method, for which Samsung registered patents.

In addition, by implementing high accuracy placement of 50 microns at high speed, it allows placement of parts from the smallest 0402 chip to ∴14mm IC part. In the aspect of PCB applicability, it allows simultaneous feeding of 2 L460 x W250 PCBs,
increasing actual productivity.

It also supports the production of L610mm long board for display as an option.
Dynamic Chip Shooter

SM411采用实现中速机的最快速贴装的三星专利On The Fly识别方式，以及双悬臂结构，从而达到芯片元器件42,000 CPH、SOP元器件30,000 CPH(各IPC标准)在同类产品中拥有世界最快速的贴片速度。并且，其在高速中也能实行50微米的高精度贴片，从而从最小0402芯片到最大□14mmIC元器件为止，皆可以实行贴片工序。在PCB对应力方面，它能同时投入二张L460 x W250PCB，从而提高了生产效率，并也附加支持生产显示器用L610mm的长板。