Rohs的要求和市场的呼唤促进了提高混合线路板贴装效率的迫切性，简化了工艺，提高资本、设备的利用率可以提高生产的效率和降低成本。SBL技术预先把焊锡膏-清先剂植入每只引脚，丰富了把通孔回流技术整入表面贴装制程的应用。有了SBL技术，通孔填充率低，叠层长针连接器的组装的难题也可在简易的回流工序得以克服。
Acknowledgements:
Profiling Testing performed in conjunetion with and through the courtesy of AIM Solder.Inc.Cranstonm,RI
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