理想状况Target Condition
1.引線腳的側面,腳跟吃錫良好。
2.引線腳與板子焊墊間呈現凹面焊錫帶。
3.引線腳的輪廓清楚可見。
1.side face and footprint have good solder fillet
2.concave fillet between land and lead
3.the shape(profile)of lead be clearly visible
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允收状况6 Accept Condition
1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。
2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。
3.引線腳的輪廓可見。
1.Good solder flow up and concave fillet between land and lead
2.Concave solder fillet between side face of lead and land
3.The shape (profile) of lead (footprint) be clearly visible
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拒收状况6 Reject Condition
1.焊錫帶延伸過引線腳的頂部(MI)。
2.引線腳的輪廓模糊不清(MI)。
3.Whichever is rejected .
1.solder flow cover the end (TIP) of lead
2.The shape (profile) of lead not be visible clearly
3.Whichever is rejected