理想状况Target Condition
1.凹面焊錫帶存在於引線的四側
2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。
3.引線的輪廓清楚可見。
4.所有的錫點表面皆吃錫良好。
1.Solder concave fillet on the 4 face of lead
2.solder flow up to the angle high point A,B
3.Lead shape(profile)can be clearly visible
4.Good soldering joint at every solder contact
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允收状况7 Accept Condition
1.焊錫帶存在於引線的三側
2.焊錫帶涵蓋引線彎曲處兩側的50%以上(h≧1/2T)。
1.Solder concave fillet on the 3 face of lead
2.Height of solder flow-up on the lead angle(h) shall over 1/2 angle height(T)
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拒收状况7 Reject Condition
1.焊錫帶存在於引線的三側以下(MI)。
2.焊錫帶涵蓋引線彎曲處兩側的50%以下(h<1/2T)(MI)。
3.Whichever is rejected .
1.Solder concave fillet is less 3 face
2.Height of solder flow-up on the lead angle(h) under 1/2 angle height(T)
3.Whichever is rejected