理想状况Target Condition
1.凹面焊錫帶存在於引線的四側
2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。
3.引線的輪廓清楚可見。
4.所有的錫點表面皆吃錫良好。
1.Solder concave fillet on the 4 face of lead
2.solder flow up to the angle high point A,B
3.Lead shape(profile)can be clearly visible
4.Good soldering joint at every solder contact
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允收状况9 Accept Condition
1.凹面焊錫帶延伸到引線彎
曲處的上方,但在組件本
體的下方。
2.引線頂部的輪廓清楚可見。
1.Solder flow up to top of lead angle and not touch the body
2.Shape(profile)of lead angle can be visible clearly
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拒收状况9Reject Condition
1.焊錫帶接觸到組件本體(MI)。
2.引線頂部的輪廓不清楚(MI)。
3.錫突出焊墊邊(MI)。
4.Whichever is rejected .
1.Solder had touched the body
2.Shape (profile) of lead angle can not be visible clearly
3.Excess solder on the side of solder land