理想状况Target Condition
1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3T以上。
2.錫皆良好地附著於所有可
焊接面。
1.Solder flow up from land (bottom of component solder termination to the 2/3 Height of component (T)
2.Good solder fillet on the all solder able terminations (face)
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允收状况10 Accept Condition
1.焊錫帶延伸到晶片端電極高度的25%以上。
(h≧1/4T)
2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X≧1/4H)
1.1/4 component height be fillet by solder at least
2.Solder flow spread on the land shall 1/4 width of component height at least , (Count from tip of component)
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1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。
(h<1/4T)
2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。
(X<1/4T)
3.Whichever is rejected .