理想状况Target Condition
1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3H以上。
2.錫皆良好地附著於所有可焊接面。
1.Solder flow up from land (bottom of component solder termination to the 2/3 Height of component (T)
2.Good solder fillet on the all solder able terminations (face)
$Page_Split$
允收状况12 Accept Condition
1.焊錫帶稍呈凹面並且從晶片端電極底部延伸到頂部。
2.錫未延伸到晶片端電極頂部的上方。
3.錫未延伸出焊墊端。
4.可看出晶片頂部的輪廓。
1.Solder concave fillet be formed from land to top of component
2.Solder do not overhang component
3.Solder do not spread out of land
4. Shape (profile) of component termination be visible
$Page_Split$
拒收状况12 Reject Condition
1.錫已超越到晶片頂部的上方
(MI) 。
2.錫延伸出焊墊端(MI)。
3.看不到晶片頂部的輪廓(MI)
。
4.Whichever is rejected .