1.零件平貼於機板表面。
2.浮高判定量測應以PCB零件面與零件基座之最低點為量測依據。
1.Component is perpendicular and base is parallel to board surface
2.The floating height is measured from face of PCB substrate to the lowest point of component
$Page_Split$允收状况17 Accept Condition
1.量測零件基座與PCB零件面之
最大距離須≦2.0mm。
(Lh≦2.0mm)
2.零件腳未折腳與短路。 3.臥式COIL之Lh≦2mm .
Wh≦2mm)不受第1點之限制
1.The height of the component body above the land “Lh”is 2.0mm maximum
2.No leads be shorted or bended of component
3.Coil floating be specified to 2mm maximum
$Page_Split$拒收状况17 Reject Condition
1.量測零件基座與PCB零件面之最大距離＞2.0mm(MI)。
(Lh＞2.0mm)
2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。
3.臥式COIL之Lh或Wh>2mm判定拒收(MI) 。
4.Whichever is rejected