1.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。
2.機構零件基座平貼PCB零件面，無浮高傾斜。(a,b,c,d四點平貼於PCB）。
1.The floating height is measure from face of PCB substrate to the lowest point of component
2.The base of constructive component shall touch the face of PCB substrate (a,b,c,d point touch PCB)
$Page_Split$允收状况19 Accept Condition
1.短軸a,b兩點平貼PCB或垂直上浮,但c,d兩點浮高≦0.8mm。(Lh ≦0.8mm)
2.錫面可見零件腳出孔
3.無短路。
1.The height of component short axis side above the land is 0.8mm maximum
2.Lead protrusion can be identified on solder side
3.No solder bridge
$Page_Split$拒收状况19 Reject Condition
1.短軸a,b兩點平貼PCB或垂直上浮,但c,d兩點浮高＞0.8mm(MI)。(Lh ＞0.8mm)
2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。
3.短路(MA)。
4.Whichever is rejected .