15.Coplanarity( 共面現象 )

        拒收                              良好情況

缺點描述 :

The tips of fine-pitch device leads did not sit properly on the copper pads on a PCB prior to solder process leading to a gap after solder.

可能原因 :

Mishandling of components can cause bent leads 

可行的預防方法 :

Usage of automated handlers to handle large volumes of fine-pitch devices ICs with minimal damage to leads which could be cause by manual placement   

重工注意事項 :

Component is desoldered with the help of desoldering wick .The cracked component is discarded and the correct component is soldered back.