3.TSSOP(Thin Small Shrink Outline Package)~
增加热效应,增加散热150%，
脚数8-80,主体3mm,4mm,6.1Mm(宽),厚0.9MM(4.4;6.1) 厚0.85(3)
pitch~0.4mm~0.65mm
4.SSOP(Small Shrink Outline Package)~
脚数8-64主体209~300mils(5.3mm~10.2mm),
pitch0.65mm~1.27mm
脚宽(0.2m~0.34mm),增加散热110%
5.SOP(Shrink Outline Package)~
Pitch 1.27mm
6.SOJ~J型脚
脚宽(0.33mm~0.51mm)
7.TSOP(Thin Small Outline Package)~
比较薄,厚度1.0mm,pitch 0.5mm~1.27mm
8.CQFP(Ceramic Quad Flat Pack)~
陶瓷材质,脚数14~304,pitch 15.7mils~50,盖子接缝于400度~460度处理
9.LCC(Leadless Ceramic Crrier)~
陶瓷材质,以pad取代lead, picth 1.0mm~1.27mm 脚数16~84
10.BQFP(Bumpered Quad Flat Pack)~
在四周有缓冲槽杆,pitch 0.636mm(25mil)
11.QFP(Plastic Quad Flat Pack)~
Pitch 0.4mm~1mm 厚2mm以上
12.LQFP(Low Profile Quad Flat Pack)~
比较薄1.4mm footprint 2.0mm 脚数32~256
bodysize 5x5m~28x28mm pitch0.3mm~0.65mm
13.FC(Flip Chip)
14.FC CSP(Flip Chip CSP)~
将fc以CSP方式处理
15.CBGA(Ceramic Ball Grid Array)~
以陶瓷为基底,环气胶or金属盖,接缝封胶,锡球90Pb/10Sn
本体15mm-32.5mm, pitch 1.27mm
16.PBGA(Plastic Ball Grid Array)~
改善热效应,增大SMT可靠度, pitch 1.0mm以上,球63/37 SnPb
1.0mm<=>球径0.5mm; 0.63 mm;1.27mm-->球径0.76mm
1.5mm-->球径0.76mm,本体13mm~45mm
17.CSP(Chip Scale Package)
球径0.3mm pitch 0.5mm
18.MLF(Micro Lead Frame)
19.µBGA
Pitch0.5-0.8 球径0.3